|
View
| 4-point probe - CMT SR2000N | 103 | Metrology | B | AIT | CMT-SR2000N |
|
View
| ALD - Oxford FlexAl | 445 | Thin film deposition | C | Oxford Instruments | FlexAl |
|
View
| Aligner & Assembler - Ciposa - LCD line | 509 | Other processes | B | Ciposa SA | Switzerland |
|
View
| Buffing tool - LCtec - LCD line | 507 | Other processes | C | LC-tec AB | ? |
|
View
| Chip scanner - Raith | 119 | Metrology | C | Raith | Chip Scanner Two-HS |
|
View
| CMP Polishing & Lapping tool - Logitech PM5 #1 | 1006 | Other processes | C | Logitech | PM5 |
|
View
| CMP Polishing & Lapping tool - Logitech PM5 #2 | 1007 | Other processes | C | Logitech | PM5 |
|
View
| Critical point dryer - Tousimis | 438 | Other processes | A | Tousimis | Autosamdri 931 GL |
|
View
| CVD - Aixtron - CNT | 1440 | Thin film deposition | C | Aixtron | Black Magic 2-inch |
|
View
| CVD - Aixtron - Graphene | 1443 | Thin film deposition | C | Aixtron | BM HT Pro 2-inch |
|
View
| CVD - Carbolite - 2D materials | 1452 | Thin film deposition | A | Carbolite | EZS-3G 12/600B 1200C |
|
View
| CVD - MgB2 - PVD hybrid | 1165 | Thin film deposition | C | Chalmers | - |
|
View
| CVD - MTI - 2D materials | 1451 | Thin film deposition | B | MTI | - |
|
View
| CVD - MTI - Graphene | 1446 | Thin film deposition | A | MTI Corporation | OTF-1200X-4-II-C4OV-SL |
|
View
| CVD - Parylene | 1180 | Thin film deposition | A | SCS | PDS 2010 Labcoter |
|
View
| Dicing Saw - Disco DAD3321 | 1015 | Dicing | C | Disco | 3321 |
|
View
| Dicing saw - Disco DAD3350 | 1011 | Dicing | C | Disco | DAD3350 |
|
View
| Diffractometer Xray - Panalytical XPert | 121 | Metrology | C | Panalytical | XPert PRO MRD |
|
View
| Dry etch IBE - Oxford Ionfab 300 Plus | 416 | Dry etching | D | Oxford | Ionfab 300 Plus |
|
View
| Dry Etch ICP - Oxford - Deep Silicon etch | 311 | Dry etching | D | Oxford Instruments | Plasma Pro 100 |
|
View
| Dry etch ICP - Oxford Plasmalab 100 - Two chambers | 404 | Dry etching | D | Oxford Plasma Technology | Plasmalab 100 ICP180 |
|
View
| Dry etch ICP - Oxford PlasmaPro 100 | 405 | Dry etching | D | Oxford Instruments | PlasmaPro 100 Cobra ICP 180 |
|
View
| Dry etch ICP - Oxford PlasmaPro 100 Cl2 | 429 | Dry etching | D | Oxford | PlasmaPro 100 |
|
View
| Dry etch ICP - STS | 305 | Dry etching | D | STS | ICP MPX |
|
View
| Dry etch RIBE - Oxford Ionfab 300 | 412 | Dry etching | C | Oxford Plasma Technology | Ionfab 300 |
|
View
| Dry etch RIE - Advanced Vacuum | 418 | Dry etching | C | PlasmaTherm/Advanced Vacuum | Batchtop m/91 |
|
View
| Dry etch RIE - Plasma-Therm | 419 | Dry etching | C | Plasmatherm | BatchTop m/95 |
|
View
| Dry etch RIE - Plasma-Therm - Oxygen | 422 | Dry etching | C | Plasma Therm | BatchTop RIE |
|
View
| Dry etch RIE - SAMCO Oxygen | 423 | Dry etching | C | SAMCO | 10NR |
|
View
| Dry etch Stripper - TePla | 228 | Dry etching | C | TePla AG | 300PC |
|
View
| Dry Release Etch - Vapor HF Etcher - KLA | 315 | Dry etching | C | ?? | ?? |
|
View
| Dry Release Etch - XeF2 - Memstar | 314 | Dry etching | C | Memstar | ORBIS ALPHA |
|
View
| EBL - JEOL JBX 9300FS | 217 | Lithography | E | JEOL Ltd. | JBX9300FS |
|
View
| EBL - Raith EBPG 5200 | 215 | Lithography | E | Raith | EBPG 5200 |
|
View
| EBL Sample pre-aligner | 242 | Lithography | A | Chalmers MC2 | PAMS 1101 |
|
View
| Ellipsometer - J.A. Woollam RC2 | 135 | Metrology | C | J. A. Woollam | RC2 |
|
View
| Evaporator - AVAC | 420 | Thin film deposition | C | AVAC | HVC600 |
|
View
| Evaporator - Edwards | 425 | Thin film deposition | B | Edwards | Auto 306 |
|
View
| Evaporator - Lesker Nano Cr | 455 | Thin film deposition | B | Lesker | Nano36 |
|
View
| Evaporator - Lesker PVD 225 #1 | 451 | Thin film deposition | D | Lesker | PVD 225 |
|
View
| Evaporator - Lesker PVD 225 #2 | 452 | Thin film deposition | D | Lesker | PVD 225 |
|
View
| Evaporator - Lesker Spectros | 434 | Thin film deposition | D | Lesker | Spectros |
|
View
| Evaporator - Plassys | 521 | Thin film deposition | D | Plassys | MEB 550 S |
|
View
| Evaporator - Plassys UHV | 522 | Thin film deposition | A | Plassys | MEB 550 SL3 - UHV |
|
View
| Evaporator - Varian | 406 | Thin film deposition | C | Varian | VT 118 UHV |
|
View
| Film stress measurement | 137 | Metrology | B | KLA Tencor | FLX 2320 |
|
View
| Flood exposure - Bachur & Associates - DUV | 261 | Lithography | B | Bachur & Associates | LS 150X-5C2 500W |
|
View
| Fume Hood - Acid & Base - HF & BOE Work | 656 | Wet processing | A | Stangl | Fume Hood |
|
View
| Fume Hood - Acid & Base - Hot Acid Work | 236 | Wet processing | A | Stangl | Fume Hood |
|
View
| Fume Hood - Acid & Base - PLD target polishing | 659 | Wet processing | A | Stangl | Fume Hood |
|
View
| Fume Hood - Acid & Base - Wash-up | 660 | Wet processing | A | Stangl | Fume Hood |
|
View
| Fume Hood - Solvent | 234 | Wet processing | A | Stangle | Fume Hood |
|
View
| Fume hood - Solvent - Dicing preparation | 1002 | Wet processing | A | Stangl | Fume Hood |
|
View
| Fume Hood - Solvent - Polishing preparation | 1001 | Wet processing | A | Stangl | Fume Hood |
|
View
| Furnace - Centrotherm #1-1 Oxidation (restricted) | 7071 | Thermal processing | B | Centrotherm | Dry oxidation |
|
View
| Furnace - Centrotherm #1-2 Wet & dry oxidation (public) | 7072 | Thermal processing | B | Centrotherm | Wet oxidation |
|
View
| Furnace - Centrotherm #1-3 Wet & dry oxidation | 7073 | Thermal processing | B | Centrotherm | Wet oxidation |
|
View
| Furnace - Centrotherm #3-2 Low temp anneal | 7052 | Thermal processing | B | Centrotherm | Au anneal |
|
View
| Furnace - Centrotherm #3-3 High temp anneal | 7053 | Thermal processing | B | Centrotherm | Hi temp anneal |
|
View
| Furnace - Centrotherm #4-2 LPCVD - TEOS | 7082 | Thermal processing | C | Centrotherm | LP-TEOS |
|
View
| Furnace - Centrotherm #4-3 LPCVD - SiN | 7083 | Thermal processing | C | Centrotherm | LPCVD Furnace |
|
View
| Furnace - Centrotherm #4-4 LPCVD - Polysilicon | 7084 | Thermal processing | C | Centrotherm | LP-Polysilicon |
|
View
| Furnace - Graphene SiC | 1449 | Thermal processing | B | Graphensic | - |
|
View
| Furnace - Lenton | 1012 | Thermal processing | A | Lenton | AWF 12/65 |
|
View
| Furnace - Thermolyne - BCB cure | 436 | Thermal processing | A | Barnstead Thermolyne | 47900 |
|
View
| Furnace - Thermolyne - Open Tube/1600°C | 713 | Thermal processing | B | Barnstead/Thermolyne | Thermolyne- M. 59340 |
|
View
| Furnace - Wet oxidation | 411 | Thermal processing | C | Chalmers | Furnace for III/V materials |
|
View
| Glue Dispensing System - LCD line | 516 | Thin film deposition | B | StepCraft 210 | MetCal modell DX-250. |
|
View
| Hotplate - Solar-semi & BLE - Microwave line | 535 | Lithography | A | PM-plast | Wet bench |
|
View
| Hotplate - Wenesco - SU8/BCB | 247 | Lithography | A | Wenesco | Custom |
|
View
| Intercom Set 2, yellow | 90005 | Infrastructure | A | Eartec | UltraLITE UL5S HD Kit |
|
View
| Laminator for SUEX Dry Film Photoresist | 518 | Lithography | A | GBC | PRO SERIES 3600 |
|
View
| Laser writer - DWL 2000 | 262 | Lithography | C | Heidelberg Instruments | DWL 2000 |
|
View
| Laser Writer - MLA 150 | 271 | Lithography | D | Heidelberg Instruments | MLA 150 |
|
View
| Mask aligner - Canon PPC-210 | 1117 | Lithography | C | Canon | PPC-210 |
|
View
| Mask aligner - Suss MA 6 #2 | 213 | Lithography | C | Suss MicroTec | MA6 |
|
View
| Mask aligner - Suss MA/BA 6 #1 | 205 | Lithography | C | Suss MicroTec | MA/BA 6 |
|
View
| Mask aligner - Suss MJB3 UV 400 #1 | 210 | Lithography | C | Karl Suss | MJB3 |
|
View
| Mask aligner - Suss MJB3 UV 400 #2 | 268 | Lithography | C | Karl Suss | MJB3 |
|
View
| Maskless lithography - SmartPrint | 1121 | Lithography | B | Microlight 3D | SmartPrint |
|
View
| MBE - EPI 930 | 806 | Epitaxy | E | MBE | EPI 930 |
|
View
| MBE - Riber C21 | 808 | Epitaxy | E | Riber | Compact 21 T-E Cluster |
|
View
| Microscope - Olympus BX52 | 1113 | Metrology | A | Olympus | BX51 |
|
View
| Microscope - Olympus MX40 | 635 | Metrology | A | Olympus | MX40 |
|
View
| Microscope - Olympus MX40 - III/V area | 630 | Metrology | A | Olympus | MX40 |
|
View
| Microscope - Olympus MX40 - Silicon area | 102 | Metrology | A | Olympus | MX40 |
|
View
| Microscope - Olympus MX50 - III/V area | 106 | Metrology | A | Olympus | MX50 |
|
View
| Microscope - Olympus MX50 - Metrology area | 125 | Metrology | A | Olympus | MX50 |
|
View
| Microscope - Olympus MX50 - Nano area | 266 | Metrology | A | Olympus | MX50 |
|
View
| Microscope - Olympus MX50 - Nano area | 243 | Metrology | A | Olympus | MX50 |
|
View
| Microscope Automatic - Nikon L200ND | 124 | Metrology | B | Nikon | L200ND |
|
View
| Microscope stereo - Olympus SZH-11 | 126 | Metrology | A | Olympus | SZH-10 |
|
View
| Microscope stereo - Olympus SZX-12 | 638 | Metrology | A | Olympus | SZX-12 |
|
View
| Microscope stereo - Olympus SZX-9 - PL2 | 1010 | Metrology | A | Olympus | SZX-9 |
|
View
| Mobile phone | 90004 | Infrastructure | A | Samsung | S10 |
|
View
| Nanoimprint - CNI v2 | 263 | Lithography | B | NILT | CNI |
|
View
| Ozone Cleaning - FHR | 229 | Other processes | B | FHR Anlagenbau GmbH | UVOH 150 |
|
View
| Ozone Cleaning - Novascan | 130 | Sample prep | B | Novascan | PSD-UVT |
|
View
| Parameter Analyzer - Keithley 4200SCS | 123 | Metrology | B | Keithley | 4200-SCS |
|
View
| PECVD - Oxford | 309 | Thin film deposition | C | Oxford Instruments | ?? |
|
View
| PLD - Calas System | 11411 | Thin film deposition | C | Chalmers/Staffan Pehrson | Generation III |
|
View
| PLD - Carbon System | 11413 | Thin film deposition | C | Chalmers | - |
|
View
| PLD - Compex 205 Laser | 1141 | Thin film deposition | C | Lambda-Physik | Compex 205 |
|
View
| PLD - DCA Cluster | 1142 | Thin film deposition | C | DCA Instruments | UHV PLD |
|
View
| PLD - RHEED System | 11412 | Thin film deposition | C | Chalmers/TSST | High pressure RHEED |
|
View
| PLD - Small System | 11401 | Thin film deposition | B | Chalmers/Staffan Pehrson | Generation I |
|
View
| Raman microscope - Horiba | 128 | Metrology | B | Horiba | XploRA |
|
View
| RTP - AccuThermo AW610 - InP | 431 | Thermal processing | C | Allwin21 | AccuThermo AW610 |
|
View
| RTP - AccuThermo AW610 - Wide bandgap | 433 | Thermal processing | C | Allwin21 | AccuThermo AW610 |
|
View
| RTP - JIPELEC JetFirst 100 | 435 | Thermal processing | C | JIPELEC | JetFirst 100 |
|
View
| RTP - JIPELEC JetFirst 200 | 437 | Thermal processing | C | JIPELEC | JetFirst 200 |
|
View
| RTP - STEAG | 402 | Thermal processing | C | Steag | SHS 100M |
|
View
| Scriber - Suss - Hard wafers | 1009 | Dicing | A | - | - |
|
View
| Scriber - Suss - Soft wafers | 413 | Dicing | A | - | - |
|
View
| Scriber breaker - Loomis | 1013 | Dicing | B | Loomis | LSD-100 |
|
View
| SEM - JEOL JSM 6301F | 110 | Metrology | C | JEOL Ltd. | JSM6301F |
|
View
| SEM - Zeiss Gemini 560 | 150 | Metrology | A | Zeiss | Gemini 560 |
|
View
| SEM - Zeiss Supra 55 - EDX | 115 | Metrology | C | Zeiss | Supra 55 VP |
|
View
| SEM - Zeiss Supra 60 VP - EDX | 116 | Metrology | C | Zeiss | Supra 60 VP |
|
View
| SEM- Zeiss Sigma 360 | 151 | Metrology | A | Zeiss | Sigma 360 |
|
View
| Software - GenISys BEAMER | 1410 | Lithography | A | GenISys GmbH | Proximity Correction |
|
View
| Software - GenISys LAB | 1411 | Lithography | A | GenIsys | LAB simulation package |
|
View
| Software - Proxecco proximity correction | 1400 | Lithography | B | PDF Solutions GmBH | Proxecco-7.0 |
|
View
| Software - SPM/AutoCAD | 140 | Metrology | B | HP | 140 |
|
View
| Solar-Semi Hot Plate | 629 | Lithography | A | Solar-Semi | Wet bench |
|
View
| Spectrometer EDX - IXRF | 117 | Metrology | B | IXRF | - |
|
View
| Spinner - BLE | 218 | Lithography | A | BLE | BLE |
|
View
| Spinner - BLE & HMDS hotplate - Microwave line | 534 | Lithography | A | PM-plast | Wet bench |
|
View
| Spinner - Polos & hotplates - Unconventional resists | 251 | Lithography | A | Polos + BLE | Polos + Delta200_Hotplates |
|
View
| Spinner - Suss LabSpin6 | 255 | Lithography | A | Suss Microtech | - |
|
View
| Spinner - Suss LabSpin6 | 219 | Lithography | A | Suss Microtech | - |
|
View
| Spinner - Suss LabSpin6 | 220 | Lithography | A | Suss Microtech | - |
|
View
| Spinner - Suss LabSpin6 | 501 | Lithography | A | Stangl | #501 |
|
View
| Spinner - Suss LabSpin6 | 1116 | Lithography | A | SUSS MicroTec | 1116 |
|
View
| Spinner - Suss RCD8 | 209 | Lithography | C | Suss | RCD8 |
|
View
| SPM - Bruker Dimension 3100 | 132 | Metrology | C | Bruker | Dimension 3100 SPM |
|
View
| SPM - Bruker Dimension ICON | 134 | Metrology | C | Bruker | Dimension ICON |
|
View
| Sputter - AJA | 427 | Thin film deposition | D | AJA International | AJA Orion 6-UD |
|
View
| Sputter - Balzers | 407 | Thin film deposition | C | Balzers/Pfeiffer | PLS 550 |
|
View
| Sputter - DCA - Quantum | 428 | Thin film deposition | D | DCA | MTD 620 |
|
View
| Sputter - DCA Cluster - Metals | 1144 | Thin film deposition | D | DCA | MTD 450 |
|
View
| Sputter - DCA Cluster - Oxides | 1143 | Thin film deposition | D | DCA | MTD 450 |
|
View
| Sputter - FHR | 400 | Thin film deposition | D | FHR | MS150 |
|
View
| Sputter - NORDIKO | 401 | Thin film deposition | B | Nordiko | 2000 |
|
View
| Sputter - Pfeiffer | 426 | Thin film deposition | C | Pfeiffer Vacuum | SLS-630G "Spider" |
|
View
| Substrate bonder - LNF | 1021 | Dicing | A | Logitech | ? |
|
View
| Substrate bonder - Suss SB6 | 269 | Other processes | C | - | - |
|
View
| Surface profiler - Sensofar neox - Optical | 131 | Metrology | C | Sensofar | Neox 3D |
|
View
| Surface profiler - Tencor AS500 #1 | 230 | Metrology | B | Tencor | AS500 |
|
View
| Surface profiler - Tencor AS500 #2 | 232 | Metrology | B | KLA Tencor | AS500 |
|
View
| Surface profiler - Tencor P15 | 108 | Metrology | B | KLA Tencor | P-15 |
|
View
| Transfer stage - Manual for 2D and 1D materials | 1455 | Device mounting | A | ? | ? |
|
View
| UV illumination box | 511 | Other processes | A | Solectro AB | ?? |
|
View
| Vacuum oven - Hereaus | 500 | Thermal processing | A | Hereaus | #500 |
|
View
| Vacuum oven - Polyimide | 550 | Thermal processing | A | Yield Engineering Systems | YES-PB6 |
|
View
| Vacuum packer - LCD line | 510 | Other processes | A | Multivac | 509.5 |
|
View
| Vacuum sealer | 540 | Other processes | A | AirZero | AZ-450 |
|
View
| Wafer Expander - Dynatex | 1017 | Other processes | A | Dynatex | DXE Wafer Expander |
|
View
| Wafer Inspection System - IR | 127 | Metrology | A | - | - |
|
View
| Wet Bench - Acid & Base | 1110 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base | 623 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base | 653 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base | 654 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base - Al-etch bath | 652 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base - BOE bath | 657 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base - Chemical preparation | 1309 | Wet processing | A | Stangl | 0 |
|
View
| Wet Bench - Acid & Base - Developer Bath - Microwave line | 532 | Wet processing | A | PM-plast | Wet bench |
|
View
| Wet Bench - Acid & Base - Developer Spinner - Osiris | 204 | Lithography | A | Osiris | Osiris BASIXX |
|
View
| Wet Bench - Acid & Base - Developer Work | 208 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base - Developer Work | 1118 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base - Developer Work - Microwave line | 533 | Wet processing | A | PM-plast | Wet bench |
|
View
| Wet Bench - Acid & Base - Electroplating | 621 | Wet processing | B | Stangl | Wet bench |
|
View
| Wet Bench - Acid & Base - Standard Clean baths (SC1/SC2) | 651 | Wet processing | B | Stangl | Wet bench |
|
View
| Wet Bench - Hotplate & HMDS & Oven | 260 | Lithography | A | Stangl | Stangl |
|
View
| Wet Bench - Solvent | 1112 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Chemical preparation | 1302 | Wet processing | A | Stangl | - |
|
View
| Wet Bench - Solvent - Developer Work | 256 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Development work & Hot Plate | 253 | Wet processing | A | Stangl + BLE | Wet bench |
|
View
| Wet Bench - Solvent - Liftoff Bath | 624 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Mask cleaning | 505 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Megasonic bath | 628 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Remover Bath | 655 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Ultrasonic bath | 625 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Ultrasonic bath | 622 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Ultrasonic bath | 620 | Wet processing | A | Stangl | Wet bench |
|
View
| Wet Bench - Solvent - Ultrasonic bath - Microwave line | 531 | Wet processing | A | PM-plast | Wet bench |
|
View
| Wet bench Acid & Base - Developer work | 627 | Lithography | A | Stangl | Wet bench |
|
View
| White Light Reflectance Spectroscopy (WLRS) - ThetaMetrisis | 113 | Metrology | A | Theta Metrisis | FR-Pro-UV/VIS |
|
View
| X-ray photoemission spectroscopy – Scienta Omicron | 11414 | Metrology | C | Scienta-Omicron GmbH | Argus CU |