Tool #401 - Nordiko 2000 Sputter A sputter down tool for general use with three 6" magnetrons and one 1,5". Three magnetrons can be used for DC sputtering and one for RF. The substrate plate can be cooled or heated as well as RF-biased. Process gases are Argon, Nitrogen and Oxygen. It is possible to rotate/wobble and/or raise/lower the table during rotation. Substrate size 100 mm (it is possible to load 150 mm but the uniformity will suffer). Pumping system is manual, the high vacuum pump is a CTI 8” cryo which gives a base pressure of 5*10E-7 mbar. Available materials are: Al, Al2O3, Al/Si(2%), Au, Hf, Nb, NiFe, Pt, Si, SiO2, Si3N4, Ti, W, W/Ti.