Picture of Dry etch RIE - Plasma-Therm
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AVAILABLE
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The PlasmaTherm Reactive Ion Etcher (RIE) is used mainly for resist stripping using an O2-plasma but can also be used for etching of other materials. Operation is by computer control with pre-defined recipies. Maximum available RF-power is 500 W. There is no load lock. - Available process gases are: O2, Ar, CF4, H2. - Sample sizes are: Small pieces, wafers with sizes 2, 3, 4, 5, 6 inch.

Tool name:
Dry etch RIE - Plasma-Therm
Area/room:
Processlab 1
Category:
Dry etching
Manufacturer:
Plasmatherm
Model:
BatchTop m/95
Max booking time, day:
2 hours
Max booking time, night:
4 hours
No. of future bookings:
4

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