Picture of Wet Bench - Acid & Base - BOE bath
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Wet bench dedicated for silicon oxide etche. Equipped with a BOE (Buffered Oxide Etch) bath for wafers up to 6". Only wafer carriers with a green mark are allowed here. The bench is also equipped with a Rinse and Dryer, which is set up för 4" wafers.

Typical SiO2 etch rate is ca 80 nm/min.

BOE contains HF - make sure you use correct PPE and that you know where to find the Hexafluorine eye showers and HF-gel!

Tool name:
Wet Bench - Acid & Base - BOE bath
Area/room:
Processlab 1
Category:
Wet processing
Manufacturer:
Stangl
Model:
657
Max booking time, day:
4 hours
Max booking time, night:
4 hours
No. of future bookings:
5

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