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Tool #400 – FHR MS 150 Sputter A computer controlled sputter down tool for substrates up to 150 mm, equipped with load-lock and five 200 mm magnetron sputter cathodes. Three of the magnetrons can be used for DC sputtering and two for RF, and the substrate carriers can be cooled or heated (to around 300 C) as well as RF-biased. The tool is equipped with optical spectrometer and an advanced gas flow control system for reactive sputtering control. Process gases are Argon, Nitrogen and Oxygen. Pumping is done by turbomolecular pumps in both main and load-lock chambers, the base pressure of the main chamber is 5*10E-7 mbar. Standard materials are Au, Ti, Si and Al, with the possibility to do TiN, TiO2, SiO2, Si3N4, Al2O3 and AlN reactively. Ta, Hf and Pr targets are also available.

Funded by: Knut and Alice Wallenbergs foundation.

Tool name:
Sputter - FHR
Processlab 1
Thin film deposition
Max booking time, day:
6 hours
Max booking time, night:
6 hours
No. of future bookings:


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