Wet bench dedicated for standard cleaning processing. The bench contains one bath for SC1, one bath for SC2, one bath with 2% HF for native oxide removal, 2 QDR baths for rinsing, and a Rinse and Dryer which is set up for 4" wafers.

Only wafer carriers marked with a blue dot are allowed here, except when the Rinse and Dryer is used. All materials should be non processed substrate material. Always contact tool responsible for other substrate materials.

Allowed materials (including HF-bath):

• Si
• SiO₂ (Quarts and Fused Silica only)
• SiC

More information about usage is found under the Files-tab.