Tool #405 Oxford PlasmaPro 100 Inductively Coulpled Plasma / Reactive Ion Etcher (ICP/RIE)
The Oxford PlasmaPro 100 ICP/RIE is intended for fluorine-based etching processes. The sytem is also capable of etching Si and other materials at cryogenic temperatures.
The plasma is generated near the bottom electrode and in the upper part of the chamber, independent of each other. The RF power applied to the bottom electrode is capacitive coupled, and offset by a self generated DC-bias. The RF power applied to a water-cooled antenna, winded around the ceramic part of the chamber, couples to the plasma inductively. The vertical electric field near the bottom electrode provides directionality for anisotropic etching. The ICP source can generate the high density of reactive ions needed for high etch rate.
The process chamber is equipped with a laser interferometer endpoint system.
Electrode RF power:
ICP RF power:
< 5x10-7 Torr
NF3, CF4, CHF3, O2, Ar, N2, SF6
Stage temperatur range:
-160C to 400C
100mm, or pieces placed on a 100mm transfer wafer
Funded by: Knut and Alice Wallenbergs foundation.