Picture of Mask aligner - Suss MA/BA 6 #1
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Mask aligner for small pieces, 2,3,4 and 6 inch wafers.
Resolution limit: 0,7 micron
UV intensity: 15 mW/cm2 , broadband emission constituting wavelengths 365mn(i-line), 405nm(h-line), and 436nm(g-line).
Aligning precision: Below 1 micron
Features: Double side alignment
Six automatic contact pressure modes:
Soft contact
Hard contact
Lo Vac (variable vacuum mode)
Vac contact
Proximity mode
Flood exposure
Pre-bonding option for fusion and anodic bonding
Split field microscope vision

 

Chuck travel limit, X: 10 mm

 

Chuck travel limit, Y: 10 mm

Chuck travel limit, theta: 10 deg.

Available mask holder sizes: 7"X7", 5"X5", 4"X4" and 2"X2"

Funded by: Knut and Alice Wallenbergs foundation.

Tool name:
Mask aligner - Suss MA/BA 6 #1
Area/room:
Processlab 1
Category:
Lithography
Manufacturer:
Suss MicroTec
Model:
MA/BA 6
Max booking time, day:
6 hours
Max booking time, night:
6 hours
No. of future bookings:
6

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