Picture of Substrate bonder - Suss SB6
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The substrate bonder can make anodic and fusion bondings on substrates from small pieces up to 150 mm wafers.

Tool name:
Substrate bonder - Suss SB6
Area/room:
Processlab 1
Category:
Other processes
Manufacturer:
-
Model:
-
Max booking time, day:
24 hours
Max booking time, night:
24 hours
No. of future bookings:
5

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