Picture of Dry etch RIE - Advanced Vacuum
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Placement: Process lab 1, The PlasmaTherm Reactive Ion Etcher (RIE) is used mainly for oxygen stripping and for etching using fluorine type plasma. First Installed: 1991, Upgraded 2009 with new hardware and software. Electrode size: 150 mm RF power supply: 500W RF-Products, Gases: Argon, Oxygen, CF4, CHF3

Tool name:
Dry etch RIE - Advanced Vacuum
Area/room:
Processlab 1
Category:
Dry etching
Manufacturer:
PlasmaTherm/Advanced Vacuum
Model:
Batchtop m/91
Max booking time, day:
4 hours
Max booking time, night:
4 hours
No. of future bookings:
5

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