Tool 103 is an automated system for measuring resistivity and sheet resistance of wafers and thin metal films. Measurement is by a four point probe with thin metal needles that make contact to the surface.
Measuring range is 1 mohm/sq to 2 Mohm/sq.
Max wafer size is 200 mm diameter.
Operation is normally by computer control but manual measurements are also possible.
Single point measurement as well as full wafer mapping is possible.