Picture of Laser writer - Heidelberg Instruments DWL 2000
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Intended for direct laser writing of photo resist on substrates, using a single source laser with multiple writing modes.

Writing Laser type: Diode laser, 405 nm

Optical focusing laser: 680nm

Max. substrate thickness: 9mm

Substrate sizes: 5X5mm up to 9X9"

Focal length, write mode 2: 4mm

Focus depth, write mode 2: 1.8 um

Max topographical height: 100 micron (piezo travel range=plus/minus 50 micron)

Typical distance between nozzle and substrate when in focus: 100 micron

Auto or manual alignment (global and field alignment)

Auto focus (optical or air pressure focus setting)

Write speed mode 2: 110 mm2/min

Stripe width mode 1: 800 pixels, 80 um spot size=100 nm

Stripe width mode 2: 800 pixels, 160 um spot size=200 nm

Design formats supported: GDSII, CIF, DXF and Gerber

Write Mode II:
Minimum structure size [µm] 0.7
Address grid [nm] 10
Edge roughness [3s, nm]  70
CD uniformity [3s, nm] 80

Stitching limit (X and Y): [3s, nm] 80
Alignment measurement accuracy [3s, nm]  70
Overlay accuracy [3, nm] 200
Write speed [mm2/minute] with “Diode Laser (405nm)” 110

Safe chip dimension for pneumatic focus: 10X10mm

Order of rotation/scaling in the conversion software:

Rotation is made first, then scaling

2 mm write head Z values:

Z value when write head is in upmost position:    0
Z value when focused on a 390 um wafer, using the 3" chuck: 2940

 

4 mm write head Z values:

Z value when write head is in upmost position:    0
Z value when focused on a 390 um wafer, using the 3" chuck: 2530

Z value when focused on a 390 um wafer, using the chuck for small pieces: 2590

 

Important things to consider

Loading:

  • ALWAYS center the replaceable chuck properly on the granite table, using the L-shaped tool
  • Use teflon/plastic tweezers when mounting your sample, in order to avoid scratching the chuck
  • Make sure that the substrate bottom side is clean, to avoid tilt problems/chuck contamination
  • ALWAYS use the granite table diretly when using 4" wafers. The single vacuum hole on the chuck may not be able to clamp the wafer down if the bow is too high.

Focusing:

  • Minimum allowed chip size is 5X5mm. NEVER attempt to load substrates smaller than this!
  • For chip sizes smaller than 10X10mm, optical focusing is compulsory
  • NEVER attempt the freezed focus mode on substrates bigger than 20X20mm
  • ALWAYS set the Z-limit carefully when using optical focusing, regardless of substrate size
  • ALWAYS set the Z-limit carefully when using pneumatic focusing, if you use substrates smaller than 2" wafers

CAD design:

  • KLayout editor for design making into the GDS2 format, and Beamer for pattern correction/transformations. Avoid Auto Cad/DXF format.
  • ALWAYS convert your pattern remotely, in order to reduce the booked time needed for your DWL session
  • Make sure that the origin of your design is at the center of your design
  • Make sure that the alignment marks are visible also in the higher camera magnification. Typical cross size for write mode 2 can be 50 um total length, each cross bar 10 um wide. Make sure that the alignment marks are placed on even coordinates, and easily recognizable.

Alignment:

  • For the global alignment rotation correction, select two marks as far away from each other as possible.
  • Check your alignment by moving the stage to a known coordinate, and verify the camera structure with the CAD structure at the same coordinate.


 

Tool name:
Laser writer - Heidelberg Instruments DWL 2000
Area/room:
Processlab 1
Category:
Lithography
Manufacturer:
Heidelberg Instruments
Model:
DWL 2000
Max booking time, day:
4 hours
Max booking time, night:
16 hours
No. of future bookings:
4

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