Wet bench with one spinner module and one HMDS hotplate. The spinner is intended for deposistion of photo resist and ebeam resist. It has chucks for small pieces and for wafers up to 150 mm diameter. The HMDS hotplate is intended for application of a thin layer of primer (HMDS) on wafers and other samples before coating with photo-resist or ebeam-resist. The HMDS hotplate process will also promote resist adhesion by dehydration of the surface by a short vacuum bake. Usage of the wet bench is reserved for the microwave and photonics process line