This workplace is equipped with one spinner module and one HMDS hotplate module. The spinner is intended for deposistion of photo resist and ebeam resist. We have chucks for small pieces and for wafers up to 150 mm diameter.

The HMDS hotplate module is intended for application of few monolayers layer of primer (HMDS) on wafers and other samples before coating with photo-resist or ebeam-resist. The HMDS hotplate process will promote resist adhesion by replacing the -OH molecule with a -CH3 molecule the surface by a 100C hot plate bake during the priming process.

Restricted to use within the Microwave and Photonics line.