The PlasmaTherm Reactive Ion Etcher (RIE) is used mainly for resist stripping using an O2-plasma but can also be used for etching of other materials. Operation is by computer control with pre-defined recipies. Maximum available RF-power is 500 W. There is no load lock. - Available process gases are: O2, Ar, CF4, H2. - Sample sizes are: Small pieces, wafers with sizes 2, 3, 4, 5, 6 inch.