Tool #412 Oxford Ionfab 300 Reactive Ion Beam System
The Oxford Ionfab 300 Reactive Ion Beam System is your tool-of-choice for Chlorine based reactive ion-beam etching. It is also used for inert ion milling.
The Oxford Ionfab 300 Reactive Ion Beam System is equipped with a manual load-lock, ensuring high throughput and low base pressure. The specimen holder can be tilted for directional etching at oblique angles. Ar and Cl2 can be fed into the ion beam source and Cl2 and O2 can be injected near the specimen holder. A filament-free electron emitter ensures neutral ion beam space charge.
Ar, O2, Cl2
~ 1x10-7 mbar
> 8x10-5 mbar
100mm, or pieces attached (with tape or clamps) to a 100mm transfer wafer