Tool #401 - Nordiko 2000 Sputter A sputter down tool for general use with three 6" magnetrons and one 1,5". Three magnetrons can be used for DC sputtering and one for RF. The substrate plate can be cooled or heated as well as RF-biased. Process gases are Argon, Nitrogen and Oxygen. Substrate size 100 mm (it is possible to load 150 mm but the uniformity will suffer). Pumping system is turbo and scroll pump, base pressure around 5E-6 mbar after 2 h pumping and <1*10E-6 mbar after overnight pumping. Available materials are (among others): Al, Au, Cr, Cu, Hf, Mo, Nb, Pt, Si, Ti, Zr, W, W/Ti.