The latest generation of Demcon TSST Pulsed Laser Deposition systems. Engineered for excellence, featuring in-situ RHEED technology, XPS analytical chamber and ozone process gas, it empowers atomic-level control and reproducibility across a wide spectrum of materials, including complex oxides.
SYSTEM SPECIFICATIONS
Vacuum chamber: Spherical, including ports for RHEED
Base pressure: <2x10-8 mbar (< 10-9 mbar after bakeout)
Pumpline: Turbo (300l/s), manual gate valve, manual bypass line for pumpspeed control, roughing line, allowing high pressure annealing
Process gasses: Three MFC controlled process gasses for O2, Ar, and O3)
Pressure control: Automated upstream and downstream pressure control
Deposition geometry: Vertical
Quick Loadlock access for sample and target transfer
Heating method: 100 W IR-diode laser
Max Temperature: 1100 °C (vacuum), 950 °C (oxygen atmosphere)
Sample size: 10x10 mm
Sample manipulation: XY-range 25mm, Z-range 100mm, azimuth and continuous rotation
Amount of targets: 6
Targetsize: up to 1"
Target rastering: XY range 25mm, Z range 100mm
Whole target carousel transfer through loadlock
High pressure RHEED
Electron gun specifications: 30kV
Operational process pressure: <0.5 mbar O2