Picture of Flip-Chip Bonder
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Finetech Fineplacer Femto 2 is a chip mounting tool which can host a number of processes. These include chip to chip (flip chip), chip to substrate, 2.5 and 3D packaging, thermo compression bonding, Indium cold compression and many more. Please see the documents for more information about usage guidelines and fiducial placement.

Tool name:
Flip-Chip Bonder
Area/room:
Processlab 1
Category:
Device mounting
Manufacturer:
FineTech
Model:
Fineplacer Femto 2
Tool rate:
D
Price/hour:
Low: 910 SEK
Medium: 1640 SEK
High: 2050 SEK

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