Picture of Furnace - Tempress LPCVD - SiN
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Description

Low Pressure Chemical Vapour Deposition system for stoichiometric or low stress silicon nitride from dichlorosilane (DCS) and ammonia (NH3).

Recipe Dep. rate (nm/min) Uniformity (%) n @ 633 nm Comment
         
Nitride-standard-780C-xxmin 2.9 0.5 2.01 stoichiometric SiN
LS-Nitride-standard-780C-xxmin 1.8 1.1 2.38 low-stress SiN
Details
Tool name:
Furnace - Tempress LPCVD - SiN
Area/room:
Processlab 1
Category:
Thermal processing
Manufacturer:
Tempress
Model:
TS6603RH-BM Series V
Tool rate:
C
Price/hour:
Low: 580 SEK
Medium: 1070 SEK
High: 1350 SEK
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