Tool 103 is an automated system for measuring resistivity and sheet resistance of wafers and thin metal films. Measurement is by a four point probe with thin metal needles that make contact to the surface.

Measuring range is 1 mohm/sq to 2 Mohm/sq.

Max wafer size is 200 mm diameter, min size is 10x10mm.

Operation is normally by computer control but manual measurements are also possible.

Single point measurement as well as full wafer mapping is possible.