Wet bench dedicated for silicon oxide etche. Equipped with a BOE (Buffered Oxide Etch) bath for wafers up to 6". Only wafer carriers with a green mark are allowed here. The bench is also equipped with a Rinse and Dryer, which is set up för 4" wafers.

Typical SiO2 etch rate is ca 80 nm/min.

BOE contains HF - make sure you use correct PPE and that you know where to find the Hexafluorine eye showers and HF-gel!