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Tool #405  Oxford PlasmaPro 100 Inductively Coulpled Plasma / Reactive Ion Etcher (ICP/RIE)

The Oxford PlasmaPro 100 ICP/RIE is intended for fluorine-based etching processes. The system is also capable of etching Si and other materials at cryogenic temperatures.

The system is able to etch from small chips to 6 inch wafers (no ICP for homogeneous results, please contact tool responsibles). 

The plasma is generated near the bottom electrode and in the upper part of the chamber, independent of each other. The RF power applied to the bottom electrode is capacitive coupled, and offset by a self generated DC-bias. The RF power applied to a water-cooled antenna, winded around the ceramic part of the chamber, couples to the plasma inductively. The vertical electric field near the bottom electrode provides directionality for anisotropic etching. The ICP source can generate the high density of reactive ions needed for high etch rate.

The process chamber is equipped with a laser interferometer endpoint system.


Electrode RF power:
0-600 W

ICP RF power:
0-3000 W

0-1000V (self-biased)

Base pressure:
< 5x10-7 Torr

Process pressure:
0-100 mTorr

NF3, CF4, CHF3, O2, Ar, N2, SF6

Stage temperatur range:
-160C to 400C

Wafer size:

Funded by: Knut and Alice Wallenbergs foundation.

Tool name:
Dry etch ICP - Oxford PlasmaPro 100
Processlab 1
Dry etching
Oxford Instruments
PlasmaPro 100 Cobra ICP 180
Tool rate:
Low: 910 SEK
Medium: 1600 SEK
High: 2000 SEK


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