Electroplating station designed for wafer-level deposition of either In or Au. The station consists of two permanent plating baths, each equipped with a filter unit, pump, and stirrer. The setup accommodates wafers with diameters of 2, 3, or 4 inches. The power supply is a BioLogic SP-50e potentiostat, which can be controlled via a network-connected laboratory computer.
There are 3 different processes available:
- Process 1: Indium plating
- Process 2: Gold plating
- Process 3: Benchtop plating for private solutions