Tool #417 Oxford Ionfab 300 Ion Beam System
The Oxford Ionfab 300 Ion Beam System is your tool-of-choice for simple, manually controlled, inert ion-milling.
The Oxford Ionfab 300 Ion Beam System is equipped with a 7.5 cm Kaufmann ion source generating an Argon plasma. The Argon ions are accelerated and directed towards a water cooled sample holder, that can be tilted for directional etching at oblique angles. A Tungsten filament electron emitter neutralizes the ion beam space charge.
Tool #417 is not equipped with a load-lock. However, the wafer can be loaded via a small port while nitrogen flows out of the chamber. This procedure ensures a short pump-down time.
The ion source is interlocked to the chamber vacuum and can’t be turned on, until the pressure is below 1x10-5 mbar. The typical pump-down time for 1x10-5 mbar is 10min, and for 1x10-6 mbar 60min.
~ 2x10-7 mbar
> 9x10-5 mbar
Pieces attached (with tape or clamps) to a 75mm sample holder.