2013-09-25. Mask aligner for DUV photolithography - wavelenght: 200-300nm - maximum mask size: 4 inch - maximum material size: 3 inch. Intensity: 3 mW/sqcm @ 240nm / 0.9 mW/sqcm @ 220nm - placement: Process lab 1, nanoarea. No filtering of the emission wavelength, that means we have broadband emission. The total intensity is still unknown, but should be in the region of 5-6mW or so.