Picture of Dicing saw - Loadpoint Microace 3+
Current status:
AVAILABLE
Book | Log
Show/Collapse all

You must be logged in to view files.

The Loadpoint Microace 3+ diamond saw is used to dice processed wafers etc. into chips. It can cut just about anything that is thinner than 5 mm. It can divide a wafer in 2 dimensions automatically.

Workpiece size: Up to 6"
Materials allowed: Any
Material thickness: < 5mm
Blade speed: 10 - 40 krpm
Common blade thickness: 30- 500 um
Feed rate: 0.1 mm/s-100mm/s
Tool name:
Dicing saw - Loadpoint Microace 3+
Area/room:
Saw room
Category:
Dicing
Manufacturer:
Loadpoint
Model:
Microace 3+
Max booking time, day:
4 hours
Max booking time, night:
4 hours
No. of future bookings:
5

Instructors

Licensed Users

You must be logged in to view tool modes.